Integrated circuit with radio frequency interconnect

ABSTRACT

An integrated circuit includes a first through fourth devices positioned over a substrate, the first device including first through third transceivers, the second device including a fourth transceiver, the third device including a fifth transceiver, and the fourth device including a sixth transceiver. A first radio frequency interconnect (RFI) includes the first transceiver coupled to the fourth transceiver through a first guided transmission medium, a second RFI includes the second transceiver coupled to the fifth transceiver through a second guided transmission medium, and a third RFI includes the third transceiver coupled to the sixth transceiver by the second guided transmission medium.

PRIORITY CLAIM

The present application is a continuation of U.S. application Ser. No.14/921,205, filed Oct. 23, 2015, which is incorporated herein byreference in its entirety.

BACKGROUND

In a packaged integrated circuit, there are many individual devices suchas a memory, an analog-to-digital converter, wireless communicationdevices, an application processor, and so forth. The individual devicesoften communicate with each other by a bus such as Serial PeripheralInterface (SPI) or Inter-Integrated Circuit (I²C). Alternatively, somedevices communicate by a radio frequency interconnect (RFI).

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 2 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 3 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 4 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 5 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 6 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 7 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 8 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 9 is a block diagram of an integrated circuit having a radiofrequency interconnect, in accordance with one or more embodiments.

FIG. 10 is a method of communicating in an integrated circuit having aradio frequency interconnect, in accordance with one or moreembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Radio frequency interconnects (RFI's) are usable in integrated circuitsthat are packaged by a 2D, a 2.5D, or a 3D packaging technique. Comparedto other types of interconnection techniques, such as couplingcomponents of an integrated circuit by a bus, RFI's help to conservespace by reducing a number of electrical interconnects used to couplethe components with one another. Accordingly, an integrated circuithaving the features described in the discussed embodiments is capable ofbeing physically smaller in size compared to an integrated circuit thatincludes components connected by other interconnection techniques.Compared to other types of interconnection techniques, such as couplingcomponents of an integrated circuit by a bus, RFI's help to reduce powerconsumption because of the reduced number of electrical interconnectsused to couple the components with one another. Accordingly, anintegrated circuit having the features described in the discussedembodiments is capable of consuming a lesser amount of power compared toan integrated circuit that includes components connected by otherinterconnection techniques.

An RFI, as discussed herein, connects individual components of anintegrated circuit by a transmission line or channel. In someembodiments, an RFI connects individual components of an integratedcircuit by a single-ended transmission line. In some embodiments, asingle device using a large bandwidth and/or being associated withhaving a high data transfer rate, e.g., a memory, is coupled to aprocessor by an RFI having a transmission line. In some embodiments, twoor more devices that use a lower bandwidth and/or are associated with alower data transfer rate compared to a larger-bandwidth device arecoupled to the processor by an RFI having a transmission line. In someembodiments, the transmission line includes two conductive linessuitable to transmit a signal in a differential mode. In someembodiments, the transmission line is a coplanar waveguide.

FIG. 1 is a block diagram of an integrated circuit 100 having an RFI, inaccordance with one or more embodiments. Integrated circuit 100comprises a first device 101 communicatively coupled with a seconddevice 103, a third device 105 and a fourth device 107.

First device 101 is coupled with second device 103 by a first RFI 109comprising a transceiver 109 a, a transceiver 109 b, and a first channel109 c. One of the first device 101 or second device 103 is configured totransmit or receive a first signal S1 to the other of the first device101 or second device 103 by first channel 109. In some embodiments,first channel 109 c includes a differential transmission line, asingle-ended transmission line or a waveguide. First signal S1 includesdata, signaling or command information.

First device 101 is coupled with third device 105 by a second RFI 111comprising a transceiver 111 a, a transceiver 111 b, and a secondchannel 115. One of the first device 101 or third device 105 isconfigured to transmit or receive a second signal S2 to the other of thefirst device 101 or third device 105 by second channel 115. Secondsignal S2 includes data, signaling or command information.

First device 101 is also coupled with fourth device 107 by a third RFI113 comprising a transceiver 113 a, a transceiver 113 b, and secondchannel 115. Second RFI 111 and third RFI 113 are configured to sharesecond channel 115. One of the first device 101 or fourth device 107 isconfigured to transmit or receive a third signal S3 to the other of thefirst device 101 or fourth device 107 by second channel 115. Thirdsignal S3 includes data, signaling or command information.

Second channel 115 includes a first channel portion 111 ca/111 cb(collectively referred to herein as channel portion 111 c), a secondchannel portion 113 ca/113 cb (collectively referred to herein as secondchannel portion 113) and a central channel portion 115 a. In someembodiments, second channel 115 includes a differential transmissionline, a single-ended transmission line or a waveguide. In someembodiments, at least one of first channel portion 111 c, second channelportion 113 c or central channel portion 115 a includes a differentialtransmission line, a single-ended transmission line or a waveguide.

Second channel 115 is a channel usable by each of second RFI 111 andthird RFI 113. Because at least the second RFI 111 and the third RFI 113share second channel 115, integrated circuit 100 is capable ofphysically occupying a smaller amount of space than if integratedcircuit 100 included an entirely separate channel for each individualRFI included therein.

First signal S1 has a first data rate D1, second signal S2 has a seconddate rate D2 or third signal S3 has a third data rate D3. First datarate D1, second date rate D2 or third data rate D3 are associated withthe corresponding second device 103, the third device 105, or the fourthdevice 107. In some embodiments, second data rate D2 is different fromfirst data rate D1. In some embodiments, third data rate D3 is differentfrom the first data rate D1.

In some embodiments, the first device 101, the second device 103, thethird device 105 and the fourth device 107 are positioned over a singlesubstrate 117. In some embodiments, one or more of the first device 101,the second device 103, the third device 105 or the fourth device 107 areover one or more of separate substrates 117 a-117 d. In someembodiments, at least one of first device 101, second device 103, thirddevice 105 or fourth device 107 comprise at least one of a memorydevice, a wireless communication device, e.g., a Bluetooth® module, aZigbee® module, an IEEE 802.11 wireless networking module, or anothersuitable wireless communication device, an analog-to-digital converter,a digital-to-analog converter, a sensor module, a discrete applicationprocessor for performing operations in a low power state, a hardwareprocessor, a memory controller, or another suitable device.

In some embodiments, first device 101 is a processor. In someembodiments, second device 103, third device 105, and fourth device 107are, for example, the same or different devices configured to supportdifferent data rates compared to one another. In some embodiments, firstRFI 109 is configured to support a data rate greater than second RFI 111or third RFI 113. Second RFI 111 is configured to support a data ratethat is less than, equal to or greater than third RFI 113. In someembodiments, first RFI 109 is configured to support a data rate that isgreater than about 6.93 Gbps, second RFI 111 is configured to support adata rate that is less than about 54 Mbps, and third RFI 113 isconfigured to support a data rate that is greater than about 54 Mbps andless than about 6.93 Gbps. The aforementioned values and ranges of thesupported data rates are examples to demonstrate the differences incapabilities of the first RFI 109, second RFI 111 and third RFI 113 forease of discussion, and in no way restrict the integrated circuit 100from including one or more RFIs or devices configured to supportdifferent data rates.

The transceivers 109 a, 109 b of the first RFI 109 are included astransceiver pairs in the first device 101 and the second device 103. Thetransceivers 111 a, 111 b of the second RFI 111 are included astransceiver pairs in the first device 101 and the third device 105. Thetransceivers 113 a, 113 b of the third RFI 113 are included astransceiver pairs in the first device 101 and the fourth device 107. Insome embodiments, the transceivers of the first RFI 109, the second RFI111 and the third RFI 113 are communicatively coupled with the firstdevice 101, the second device 103, the third device 105 and the fourthdevice 107.

In some embodiments, one or more of the transceivers (e.g., transceivers109 a, 109 b 111 a, 111 b, 113 a or 113 b) of the first RFI 109, thesecond RFI 111 or the third RFI 113 are configured to be transmitters orreceivers. If, for example, the integrated circuit 100 is configuredsuch that the first RFI 109, the second RFI 111 and the third RFI 113are configured to facilitate uni-directional communications, then insuch an embodiment, the transceivers 109 a, 111 a, 113 a included in thefirst device 101 are configured as transmitters and the transceivers 109b, 111 b, 113 b included in the corresponding second device 103, thethird device 105 and the fourth device 107 are configured as receivers.In some embodiments, one or more of the first RFI 109, the second RFI111 or the third RFI 113 are configured to facilitate bi-directionalcommunications.

First RFI 109 is configured to carry the first signal S1 between thefirst device 101 and the second device 103. Second RFI 111 is configuredto carry the second signal S2 between the first device 101 and the thirddevice 105. Third RFI 113 is configured to carry the third signal S3between the first device 101 and the fourth device 109.

Each of the transceivers (e.g., transceivers 109 a, 109 b 111 a, 111 b,113 a or 113 b) of the first RFI 109, the second RFI 111 and the thirdRFI 113 comprise one or more carrier generators (not shown). Thetransceivers 109 a, 109 b 111 a, 111 b, 113 a or 113 b of the first RFI109, the second RFI 111 and the third RFI 113, if operating as atransmission device, are configured to modulate data to be transmittedto one of the first device 101, the second device 103, the third device105 or the fourth device 107 based on carrier signals generated by theone or more carrier generators. The transceivers 109 a, 109 b 111 a, 111b, 113 a or 113 b of the first RFI 109, the second RFI 111 and the thirdRFI 113, if operating as a receiving device, are configured todemodulate a received first signal, a received second signal, or areceived third signal based on carrier signals generated by the one ormore carrier generators.

The first signal S1 is generated based on one or more carrier signals ofa set of N carrier signals, where N is an integer greater than 1. Thesecond signal S2 is generated based on one or more carrier signals of afirst set of carrier signals. The third signal S3 is generated based onone or more carrier signals of a second set of carrier signals. Thefirst set and the second set together form a set of M carrier signals,where M is an integer greater than 2. The first set or the second set ofcarrier signals includes at least one. In some embodiments, the sum ofthe first set and the second set of carrier signals is equal to the setof M carrier signals. The set of N carrier signals is equal to, greaterthan or equal to the set of M carrier signals. In some embodiments, thesecond set of carrier signals comprises at least one carrier signaldifferent from a carrier signal included in the first set of carriersignals. In some embodiments, each of the carrier signals in the secondset of carrier signals is different from each of the carrier signalsincluded in the first set of carrier signals.

In some embodiments, a size of the first set of carrier signals,utilized to generate the second signal S2, is related to the data ratesupported by the second RFI 111. In some embodiments, a size of thesecond set of carrier signals, utilized to generate the third signal S3,is related to the data rate supported by the third RFI 113.

In some embodiments, based on the data rate (e.g., data rate D1, D2 orD3) associated with the second device (e.g., second device 103), thethird device (e.g., third device 105), or the fourth device (e.g.,fourth device 107), a transceiver (e.g., transceiver 109 a, 109 b, 111a, 111 b, 113 a or 113 b) of the one or more transceivers (e.g.,transceiver 109 a, 109 b, 111 a, 111 b, 113 a or 113 b) is configured toselect a quantity of carriers to use for modulating data to generate thefirst signal (e.g., first signal S1), the second signal (e.g., secondsignal S2) or the third signal (e.g., third signal S3). For example, asa data rate or bandwidth associated with a device (e.g., second device103, third device 105, or fourth device 107) of the integrated circuit(e.g., integrated circuit 100) increases, the quantity of carriersignals used to modulate the data to be transmitted increases. In someembodiments, first device 101 or second device 103 is configured togenerate the first data signal S1 based on a selected quantity ofcarrier signals of the one or more carrier signals included in the thirdset of carrier signals. In some embodiments, the selected quantity ofcarrier signals is based on the first data rate D1 supported by thefirst RFI 109.

In some embodiments, first RFI 109 is configured to identify an outputsignal generated by the first device 101 or second device 103, as beingthe first signal S1 based, at least in part, on the first data rate D1associated with the second device 103. In some embodiments, second RFI111 is configured to identify an output signal generated by the firstdevice 101 or third device 105, as being the second signal S2 based, atleast in part, on the second data rate D2 associated with the thirddevice 105. In some embodiments, third RFI 113 is configured to identifyan output signal generated by the first device 101 or fourth device 107,as being the third signal S3 based, at least in part, on the third datarate D3 associated with the fourth device 107.

In some embodiments, one or more of the first RFI 109, the second RFI111 or the third RFI 113 are configured to communicate the correspondingfirst signal S1, the second signal S2, or the third signal S3 based onfrequency-division duplexing (FDD). In some embodiments, the second RFI111 and the third RFI 113 are configured to share second channel 115based on FDD. In some embodiments, the second RFI 111 is configured tocommunicate the second signal S2 between the first device 101 and thethird device 105, and the third RFI 113 is configured to communicate thethird data S3 signal between the first device 101 and the fourth device107 based on FDD.

In some embodiments, where the second RFI 111 and the third RFI 113 areconfigured to share second channel 115 based on FDD, a fundamentalfrequency of the second signal S2 is not equal to a fundamentalfrequency of the third signal S3. In some embodiments, FDD allows forbi-directional communication through one or more of the first RFI 109,the second RFI 111 or the third RFI 113.

In some embodiments, the transceivers 111 a, 111 b of the second RFI 111or the transceivers 113 a, 113 b of the third RFI 113 are configured todistinguish between the second signal S2 and the third signal S3transmitted through second channel 115 based on a fundamental frequencyof the second signal S2 and the third signal S3. In some embodiments,for example, the second RFI 111 and the third RFI 113 are configured todistinguish between the second signal S2 and the third signal S3communicated through second channel 115 based on a frequency of thesecond signal S2 and a frequency of the third signal S3. The frequencyof the second signal S2 is based on at least one of the carrier signalsof the first set of carrier signals, and the frequency of the thirdsignal S3 is based on at least one of the carrier signals of the secondset of carrier signals.

In some embodiments, one or more of the first RFI 109, the second RFI111 or the third RFI 113 is configured to cause the first signal S1, thesecond signal S2 or the third signal S3 to be communicated from atransmitting device to an intended receiving device based on thefrequency of the data signal. In some embodiments, for example, thesecond RFI 111 is configured to cause the second signal S2 to becommunicated between the first device 101 and the third device 105 basedon the frequency of the second signal S2, and the third RFI 113 isconfigured to cause the third signal S3 to be communicated between thefirst device 101 and the fourth device 107 based on the frequency of thethird signal S3.

In some embodiments, second RFI 111 and third RFI 113 are configured toshare second channel 115 based on time-division duplexing (TDD). In someembodiments, where the second RFI 111 and the third RFI 113 areconfigured to share second channel 115 based on TDD, a time oftransmission of the second signal S2 is not equal to a time oftransmission of the third signal S3. In some embodiments, thetransceivers 109 a, 109 b of first RFI 111 are configured to sharesecond channel 115 based on TDD.

In some embodiments, to facilitate the transmission of a data signalbased on TDD such that an intended receiving device receives thetransmitted data signal, one or more of the first RFI 109, the secondRFI 111 or the third RFI 113 comprise switches. In some embodiments, forexample, the second RFI 111 and the third RFI 113 comprise a pluralityof switches configured to selectively cause the second signal S2 to becommunicated between the first device 101 and the third device 105 oversecond channel 115, or to selectively cause the third signal S3 to becommunicated between the first device 101 and the fourth device 107 oversecond channel 115.

In some embodiments, the switches (shown in FIG. 4 ) are controlled byway of a control signal (shown in FIG. 4 ). In some embodiments, forexample, the second RFI 111 and the third RFI 113 are configured tocontrol the switches of the plurality of switches based on a controlsignal associated with a timing of communicating the second signal S2 orthe third signal S3. In some embodiments, TDD makes it possible tocoordinate a direction of communication through the second channel 115.

In some embodiments, the second channel 115 shared by the second RFI 111and the third RFI 113 comprises a first unidirectional couplerconfigured to facilitate a transmission from the first device 101 to thethird device 105 and from the first device 101 to the fourth device 107,and a second unidirectional coupler configured to facilitate atransmission from the third device 105 to the first device 101 and fromthe fourth device 107 to the first device 101.

In some embodiments, the first RFI 109, the second RFI 111 and the thirdRFI 113 are configured to communicate the first signal S1 between thefirst device 101 and the second device 103, to communicate the secondsignal S2 between the first device 101 and the third device 105, or tocommunicate the third signal S3 between the first device 101 and thefourth device 107 based on a handshake. In some embodiments, thehandshake is utilized to identify a transmitting transceiver (e.g.,transceiver 109 a, 109 b, 111 a, 111 b, 113 a or 113 b) of one of thefirst device 101, the second device 103, the third device 105 or thefourth device 107, and identify a receiving transceiver as a differentone of the first device 101, the second device 103, the third device 105or the fourth device 107.

In some embodiments, second channel 115 comprises a plurality ofjunctions configured to direct the second signal S2 or the third signalS3 to an intended receiver of the first device 101, the third device105, or the fourth device 107 based, at least in part, on the frequencyof the second signal S2, or the frequency of the third signal S3. Insome embodiments, first channel 109 comprises a plurality of junctionsconfigured to direct the first signal S1 to an intended receiver of thefirst device 101 based, at least in part, on the frequency of the firstsignal S1.

In some embodiments, the second channel 115 is divided into two channels(e.g., a first separate channel and a second separate channel) such thatthe second RFI 111 and the third RFI 113 do not share a common channel(e.g., second channel 115). In these embodiments, the second RFI 111includes the first separate channel and the third RFI 113 includes thesecond separate channel. In these embodiments, the second RFI 111 or thethird RFI 113 is configured in a manner similar to that of the first RFI109. In these embodiments, the transceivers of the first RFI 109, thesecond RFI 111 or the third RFI 113 are configured in a manner tosupport FDD or TDD.

FIG. 2 is a block diagram of an integrated circuit 200 having an RFI, inaccordance with one or more embodiments. Integrated circuit 200comprises features similar to the features discussed with respect tointegrated circuit 100 (FIG. 1 ), with the reference numerals increasedby 100.

Integrated circuit 200 differs from integrated circuit 100 in that thefirst RFI 209, the second RFI 211 and the third RFI 213 are configuredto facilitate uni-directional communications. As such, first RFI 209includes a first transmitter 209 a, a first receiver 209 b and a firstchannel 209 c, second RFI 211 includes a second transmitter 211 a, asecond receiver 211 b and a second channel 215, and third RFI 213includes a third receiver 213 a, a third receiver 213 b and a secondchannel 215.

Because at least the second RFI 211 and the third RFI 213 share secondchannel 215, integrated circuit 200 is capable of physically occupying asmaller amount of space than if integrated circuit 200 included anentirely separate channel for each individual RFI included therein.

First transmitter 209 a is configured to transmit first signal S1 tofirst receiver 209 b by channel 209. Second transmitter 211 a isconfigured to transmit second signal S2 to second receiver 211 b bysecond channel 215. Third transmitter 213 a is configured to transmitthird signal S3 to third receiver 213 b by second channel 215.

FIG. 3 is a block diagram of an integrated circuit 300 having an RFI, inaccordance with one or more embodiments. Integrated circuit 300comprises features similar to the features discussed with respect tointegrated circuit 100 (FIG. 1 ), with the reference numerals increasedby 200. In integrated circuit 300, the first RFI 309, the second RFI 311and the third RFI 313 are configured to facilitate bi-directionalcommunications.

Because at least the second RFI 311 and the third RFI 313 share secondchannel 315, integrated circuit 300 is capable of physically occupying asmaller amount of space than if integrated circuit 300 included anentirely separate channel for each individual RFI included therein.

FIG. 4 is a block diagram of an integrated circuit 400 having an RFI, inaccordance with one or more embodiments. Integrated circuit 400comprises features similar to the features discussed with respect tointegrated circuit 100 (FIG. 1 ), with the reference numerals increasedby 300. Integrated circuit 400 differs from integrated circuit 100 inthat the first RFI 409, the second RFI 411 and the third RFI 413comprise switches 419 a-419 f.

Switches 419 a-419 b are configured to be selectively controlled basedon a corresponding control signal CSa, CSb to coordinate thetransmission of the first signal S1 through first channel 409 c based onTDD. Switches 419 c-419 f are configured to be selectively controlledbased on a corresponding control signal CSc, CSd, CSe, CSf to coordinatethe transmission of second signal S2 through second channel 415, and thetransmission of third signal S3 through second channel 415 based on TDD.In some embodiments, TDD makes it possible to coordinate a direction ofcommunication through the first channel 409 c and the second channel415.

First channel 409 c is a first differential transmission line 421 a andsecond channel 415 is a second differential transmission line 421 b. Insome embodiments, first channel 409 c or second channel 415 is awaveguide. In some embodiments, first channel 409 c or second channel415 is a single-ended transmission line.

Because at least the second RFI 411 and the third RFI 413 share secondchannel 415, integrated circuit 400 is capable of physically occupying asmaller amount of space than if integrated circuit 400 included anentirely separate channel for each individual RFI included therein.

In some embodiments, the second channel 415 is divided into two channels(e.g., a first separate channel and a second separate channel) such thatthe second RFI 411 and the third RFI 413 do not share a common channel(e.g., second channel 415). In these embodiments, the second RFI 411includes the first separate channel and the third RFI 413 includes thesecond separate channel. In these embodiments, the second RFI 411 or thethird RFI 413 is configured in a manner similar to that of the first RFI409 (as described above).

FIG. 5 is a diagram of an integrated circuit 500 having an RFI, inaccordance with one or more embodiments. Integrated circuit 500comprises features similar to the features discussed with respect tointegrated circuit 400 (FIG. 4 ), with the reference numerals increasedby 100. Integrated circuit 500 differs from integrated circuit 400 inthat the first RFI 409 is not included.

Transceiver 511 a is configured to transmit second signal S2 totransceiver 511 b of second RFI 511. Transceiver 513 a is configured totransmit third signal S3 to transceiver 513 b of third RFI 513. In thisembodiment, second signal S2 is generated based on a first carriersignal and a second carrier signal. In this embodiment, third signal S3is generated based on a fifth carrier signal.

Switches 519 b-519 c and 519 e-519 f are configured to be selectivelycontrolled based on a control signal (shown in FIG. 4 ) to coordinatethe transmission of second signal S2 and third signal S3 through secondchannel 515 based on TDD. Switches 519 b and 519 e are closed to couplea transmitter portion of transceiver 511 a with a receiver portion oftransceiver 511 b. Switches 519 c and 519 f are closed to couple atransmitter portion of transceiver 513 a with a receiver portion oftransceiver 513 b.

Second channel 515 is a differential transmission line 521 b. In someembodiments, second channel 515 is a waveguide or a single-endedtransmission line.

FIG. 6 is a block diagram of an integrated circuit 600 having an RFI, inaccordance with one or more embodiments. Integrated circuit 600comprises features similar to the features discussed with respect tointegrated circuit 300 (FIG. 3 ), with the reference numerals increasedby 300.

In integrated circuit 600, the first RFI 609 comprises channels 609 caand 609 cb. Channel 609 ca communicatively couples a transmitter portionof transceiver 609 a with a receiver portion of transceiver 609 b.Channel 609 cb communicatively couples a receiver portion of transceiver609 a with a transmitter portion of transceiver 609 b. Channel 609 ca isa first differential transmission line 621 a and channel 609 cb is asecond differential transmission line 621 b. In some embodiments,channel 609 ca or channel 609 cb is a waveguide. In some embodiments,channel 609 ca or channel 609 cb is a single-ended transmission line.

In integrated circuit 600, the second channel 615 is divided into twouni-directional channels (e.g., first uni-directional channel 616 andsecond uni-directional channel 617.

First uni-directional channel 616 communicatively couples transmitterportions of transceiver 611 a and transceiver 613 a with receiverportions of transceiver 611 b and transceiver 613 b. Firstuni-directional channel 616 comprises a first shared channel portion 615a and first channel portion 611 ca/611 cb (collectively referred toherein as channel portion 611 c).

Second uni-directional channel 617 communicatively couples transmitterportions of the transceiver 611 b and the transceiver 613 b withreceiver portions of the transceiver 611 a and the transceiver 613 a.Second uni-directional channel 617 comprises a second shared channelportion 615 b and a second channel portion 613 ca/613 cb (collectivelyreferred to herein as channel portion 613 c).

The first RFI 609, the second RFI 611 and the third RFI 613 areconfigured to communicate the first signal S1, the second signal S2 andthe third signal S3 using FDD. First uni-directional channel 616 is athird differential transmission line 621 c and second uni-directionalchannel 617 is a fourth differential transmission line 621 d. In someembodiments, first uni-directional channel 616 or second uni-directionalchannel 617 is a waveguide. In some embodiments, first uni-directionalchannel 616 or second uni-directional channel 617 is a single-endedtransmission line.

Because at least the second RFI 611 and the third RFI 613 share channels615 a and 615 b, integrated circuit 600 is capable of physicallyoccupying a smaller amount of space than if integrated circuit 600included an entirely separate transmission channel for each individualRFI included therein.

FIG. 7 is a block diagram of an integrated circuit 700 having an RFI, inaccordance with one or more embodiments. Integrated circuit 700comprises features similar to the features discussed with respect tointegrated circuit 600 (FIG. 6 ), with the reference numerals increasedby 100. Integrated circuit 700 differs from integrated circuit 600 inthat the second RFI 711 and the third RFI 713 are configured tofacilitate bi-directional communication through a shared channel 715.Integrated circuit 700 is capable of saving even more space thanintegrated circuit 600, at least because integrated circuit 700 includesone shared channel instead of two.

FIG. 8 is a diagram of an integrated circuit 800 having a radiofrequency interconnect, in accordance with one or more embodiments.Integrated circuit 800 comprises features similar to integrated circuit500 (FIG. 5 ), with the reference numerals increased by 300). Integratedcircuit 800 differs from integrated circuit 500 in that first RFI 809,second RFI 811 and third RFI 813 are configured to simultaneouslysend/receive first signal S1 or second signal S2 through shared channel815 by FDD.

As such, integrated circuit 809 does not utilize switches 519 a-519 f(FIG. 5 ). In this example, transceiver 811 a is configured to transmitsecond signal S2 to transceiver 811 b over shared channel 815, andtransceiver 813 b is configured to transmit third signal S3 totransceiver 813 a over shared channel 815.

FIG. 9 is a block diagram of an integrated circuit 900 having an RFI, inaccordance with one or more embodiments. Integrated circuit 900comprises features similar to integrated circuit 100 (FIG. 1 ), with thereference numerals increased by 800.

Integrated circuit 900 includes first RFI 909 having transceivers 909 aand 909 b, second RFI 911 having transceivers 911 a and 911 b, andadditional RFI's 923 having transceivers 923 a and 923 b. AdditionalRFI's 923 provide for a total quantity of X RFI's, where X is an integergreater than 1. Integrated circuit 900 is capable of having a greaterquantity or a lesser quantity of devices in comparison to the number ofRFI devices included in integrated circuit 900. Each of the RFI's isconfigured to share channel 915. In some embodiments, channel 915 is adifferential transmission line. In some embodiments, channel 915 is asingle-ended transmission line or a waveguide. Each of the transceivers909 a, 909 b, 911 a, 911 b, 923 a, 923 b comprise or have connectivityto corresponding carrier generators 925 a-925 f that are configured togenerate the carrier signals upon which data signals such as firstsignal S1, second signal S2 and third signal S3 are generated.

In some embodiments, each of the RFI's 909, 911 and 923 is configured toshare channel 915 based on FDD. In these embodiments, the carriergenerator for each RFI is configured to generate a different carrierfrequency from each other.

In some embodiments, to facilitate the communication of data signalsfrom a transmitter to an intended receiver of integrated circuit 900,channel 915 comprises one or more T-junction transmission lines 927 a,one or more cross-junction transmission lines 927 b, one or more othersuitable junction types, or a combination thereof.

In some embodiments, to facilitate the communication of data signalsfrom a transmitter to an intended receiver of integrated circuit 900, atleast one device associated with the RFI's, or at least one of thetransceivers 909 a, 909 b, 911 a, 911 b, 923 a or 923 b is configured toidentify a transmitting device and identify a receiving device based ona handshake.

Because the first RFI 109, the second RFI 111 and the third RFI 513share channel 915, integrated circuit 900 is capable of physicallyoccupying a smaller amount of space than if integrated circuit 900included an entirely separate channel for each individual RFI includedtherein.

FIG. 10 is a method 1000 of communicating in an integrated circuithaving an RFI, in accordance with one or more embodiments. Method 1000is performed by way of an integrated circuit such as integrated circuit100 (FIG. 1 ).

In step 1001, one or more transceivers (e.g., transceivers 109 a, 109 b,111 a, 111 b, 113 a, 113 b (FIG. 1 )) generate one or more of a firstsignal (e.g., first signal S1), a second signal (e.g., second signal S2)or a third signal (e.g., third signal S3) to be communicated between afirst device (e.g., first device 101) and a second device (e.g., seconddevice 103), the first device (e.g., first device 101) and a thirddevice (e.g., third device 105), or the first device (e.g., first device101) and a fourth device (e.g., fourth device 107), respectively.

The generated first signal (e.g., first signal S1) has a first data rate(e.g., D1), the second signal (e.g., second signal S2) has a second daterate (e.g., D2) or the third signal (e.g., third signal S3) has a thirddata rate (e.g., D3). The first data rate (e.g., D1), the second daterate (e.g., D2) or the third data rate (e.g., D3) are associated withthe corresponding second device (e.g., second device 103), the thirddevice (e.g., third device 105), or the fourth device (e.g., fourthdevice 107). The first RFI (e.g., first RFI 109) is configured tosupport a first data rate (e.g., D1), the second RFI (e.g., second RFI111) is configured to support a second data rate (e.g., D2), and thethird RFI (e.g., third RFI 113) is configured to support a third datarate (e.g., D3). The first data rate (e.g., D1) being greater than thesecond data rate (e.g., D2) or the third data rate (e.g., D3), and thesecond data rate (e.g., D2) being greater than the third data rate(e.g., D3).

The second signal (e.g., second signal S2) is generated based on one ormore carrier signals of a first set of carrier signals, and the thirdsignal (e.g., second signal S3) is generated based on one or morecarrier signals of a second set of carrier signals comprising at leastone carrier signal different from a carrier signal included in the firstset of carrier signals. The first signal (e.g., first signal S1) isgenerated based on one or more carrier signals of a third set of carriersignals comprising at least one carrier signal different from a carriersignal included in the first set of carrier signals and the second setof carrier signals.

In some embodiments, based on the data rate (e.g., data rate D1, D2 orD3) associated with the second device (e.g., second device 103), thethird device (e.g., third device 105), or the fourth device (e.g.,fourth device 107), a transceiver (e.g., transceiver 109 a, 109 b, 111a, 111 b, 113 a or 113 b) of the one or more transceivers (e.g.,transceiver 109 a, 109 b, 111 a, 111 b, 113 a or 113 b) is configured toselect a quantity of carriers to use for modulating data to generate thefirst signal (e.g., first signal S1), the second signal (e.g., secondsignal S2) or the third signal (e.g., third signal S3). For example, asa data rate or bandwidth associated with a device (e.g., second device103, third device 105, or fourth device 107) of the integrated circuit(e.g., integrated circuit 100) increases, the quantity of carriersignals used to modulate the data to be transmitted increases.

In step 1003, the first signal (e.g., first signal S1) is communicatedbetween the first device (e.g., first device 101) and the second device(e.g., second device 103) by way of a first RFI (e.g., first RFI 109)configured to carry the first signal (e.g., first signal S1) between thefirst device (e.g., first device 101) and the second device (e.g.,second device 103), the second signal (e.g., second signal S2)communicated between the first device (e.g., first device 101) and thethird device (e.g., third device 105) by way of a second RFI (e.g.,second RFI 111) configured to carry the second signal (e.g., secondsignal S2) between the first device (e.g., first device 101) and thethird device (e.g., third device 105), or the third signal (e.g., thirdsignal S3) is communicated between the first device (e.g., first device101) and the fourth device (e.g., fourth device 107) by way of a thirdRFI (e.g., third RFI 113) configured to carry the third signal (e.g.,third signal S3) between the first device (e.g., first device 101) andthe fourth device (e.g., fourth device 107). At least the second RFI(e.g., second RFI 111) and the third RFI (e.g., third RFI 113) share achannel (e.g., second channel 115) based on FDD or TDD.

In some embodiments, at least one of the devices of the integratedcircuit (e.g., integrated circuit 100) causes the first signal (e.g.,first signal S1) to be communicated between the first device (e.g.,first device 101) and the second device (e.g., second device 103), thesecond signal (e.g., second signal S2) to be communicated between thefirst device (e.g., first device 101) and the third device (e.g., thirddevice 105), or the third signal (e.g., third signal S3) to becommunicated between the first device (e.g., first device 101) and thefourth device (e.g., fourth device 107) by selectively controlling acombination of switches of a plurality of switches (e.g., 419 a-419 f(FIG. 4 )) included in the first RFI (e.g., first RFI 109 (FIG. 1 )),the second RFI (e.g., second RFI 111) and the third RFI (e.g., third RFI113) based on a control signal (e.g., control signal CSa, CSb, CSc, CSd,CSe, CSf or CSg). In some embodiments, the control signal (e.g., controlsignal CSa, CSb, CSc, CSd, CSe, CSf or CSg) is communicated from atransmitting device to a receiving device to coordinate reception of thetransmitted data signal. In some embodiments, the channel (e.g., channel915 (FIG. 9 )) is further shared by the first RFI.

In some embodiments, at least one device of the integrated circuitissues a handshake to cause the first RFI, the second RFI or the thirdRFI to communicate the first signal between the first device and thesecond device, to communicate the second signal between the first deviceand the third device, or to communicate the third signal between thefirst device and the fourth device by way of the shared channel. In someembodiments, the handshake comprises information identifying atransmitting device as one of the first device, the second device, thethird device or the fourth device, and identifying a receiving device asa different one of the first device, the second device, the third deviceor the fourth device.

In some embodiments, an integrated circuit includes a first devicepositioned over a substrate, the first device including first throughthird transceivers, a second device positioned over the substrate, thesecond device including a fourth transceiver, a third device positionedover the substrate, the third device including a fifth transceiver, anda fourth device positioned over the substrate, the fourth deviceincluding a sixth transceiver. A first RFI includes the firsttransceiver coupled to the fourth transceiver through a first guidedtransmission medium, a second RFI includes the second transceivercoupled to the fifth transceiver through a second guided transmissionmedium, and a third RFI includes the third transceiver coupled to thesixth transceiver by the second guided transmission medium.

In some embodiments, an integrated circuit includes a first devicepositioned over a substrate, the first device including first throughthird transmitters, a second device positioned over the substrate, thesecond device including a first receiver, a third device positioned overthe substrate, the third device including a second receiver, and afourth device positioned over the substrate, the fourth device includinga third receiver. A first RFI includes the first transmitter coupled tothe first receiver through a first guided transmission medium, a secondRFI includes the second transmitter coupled to the second receiverthrough a second guided transmission medium, and a third RFI includesthe third transmitter coupled to the third receiver by the second guidedtransmission medium.

In some embodiments, a method includes generating one or more of a firstdata signal, a second data signal or a third data signal to becommunicated between a first device and a second device, the firstdevice and a third device, or the first device and a fourth device,respectively, communicating the first data signal between the firstdevice and the second device by way of a first RFI including a firstchannel and configured to carry the first data signal between the firstdevice and the second device, and communicating one or more of thesecond data signal between the first device and the third device by wayof a second RFI comprising a second channel and configured to carry thesecond data signal between the first device and the third device, or thethird data signal between the first device and the fourth device by wayof a third RFI comprising the second channel and configured to carry thethird data signal between the first device and the fourth device.Communicating the one or more of the second data signal or the thirddata signal includes distinguishing between the second and third datasignals based on a frequency of the second data signal and a frequencyof the third data signal, or communicating a control signal tocoordinate the communicating the one or more of the second data signalor the third data signal.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. An integrated circuit, comprising: a first devicepositioned over a substrate, the first device comprising first throughthird transceivers; a second device positioned over the substrate, thesecond device comprising a fourth transceiver; a third device positionedover the substrate, the third device comprising a fifth transceiver; anda fourth device positioned over the substrate, the fourth devicecomprising a sixth transceiver, wherein a first radio frequencyinterconnect (RFI) comprises the first transceiver coupled to the fourthtransceiver through a first guided transmission medium, a second RFIcomprises the second transceiver coupled to the fifth transceiverthrough a second guided transmission medium, [[and]] a third RFIcomprises the third transceiver coupled to the sixth transceiver by thesecond guided transmission medium, and each of the second transceiverand the third transceiver is coupled to each of the fifth transceiverand the sixth transceiver by the second guided transmission medium. 2.The integrated circuit of claim 1, wherein the second guidedtransmission medium comprises: a first unidirectional coupler configuredto facilitate a transmission from the first device to the third deviceand from the first device to the fourth device; and a secondunidirectional coupler configured to facilitate a transmission from thethird device to the first device and from the fourth device to the firstdevice.
 3. The integrated circuit of claim 1, wherein each of the firsttransceiver and the fourth transceiver is configured to generate a firstdata signal based on a first number of carrier signals, each of thesecond transceiver and the fifth transceiver is configured to generate asecond data signal based on a second number of carrier signals, and eachof the third transceiver and the sixth transceiver is configured togenerate a third data signal based on a third number of carrier signals.4. The integrated circuit of claim 3, wherein the first number ofcarrier signals is based on a data rate associated with the seconddevice, the second number of carrier signals is based on a data rateassociated with the third device, and the third number of carriersignals is based on a data rate associated with the fourth device. 5.The integrated circuit of claim 4, wherein the first number of carriersis greater than a sum of the second number of carriers and the thirdnumber of carriers.
 6. The integrated circuit of claim 1, wherein thesecond RFI comprises a first plurality of switches configured toselectively connect the second guided transmission medium to each of thesecond transceiver and the fifth transceiver, and the third RFIcomprises a second plurality of switches configured to selectivelyconnect the second guided transmission medium to each of the thirdtransceiver and the sixth transceiver.
 7. The integrated circuit ofclaim 6, wherein the first plurality of switches and the secondplurality of switches are configured to be selectively controlled basedon a corresponding plurality of control signals to coordinate signaltransmission through the second guided transmission medium based ontime-division duplexing (TDD).
 8. The integrated circuit of claim 1,wherein at least one of the second RFI is configured to identify anoutput signal generated by the first device or the third device based ona first data rate associated with the third device, or the third RFI isconfigured to identify an output signal generated by the first device orthe fourth device based on a second data rate associated with the fourthdevice.
 9. The integrated circuit of claim 1, wherein the first devicecomprises a processor, and the second device comprises a memory device.10. The integrated circuit of claim 9, wherein at least one of the thirddevice or the fourth device comprises a wireless communication device.11. An integrated circuit, comprising: a first device positioned over asubstrate, the first device comprising first through third transmitters;a second device positioned over the substrate, the second devicecomprising a first receiver; a third device positioned over thesubstrate, the third device comprising a second receiver; and a fourthdevice positioned over the substrate, the fourth device comprising athird receiver, wherein a first radio frequency interconnect (RFI)comprises the first transmitter coupled to the first receiver through afirst guided transmission medium, a second RFI comprises the secondtransmitter coupled to the second receiver through a second guidedtransmission medium, a third RFI comprises the third transmitter coupledto the third receiver by the second guided transmission medium, and eachof the second transmitter and the third transmitter is coupled to eachof the second receiver and the third receiver by the second guidedtransmission medium.
 12. The integrated circuit of claim 11, wherein thefirst device comprises fourth through sixth receivers, the second devicecomprises a fourth transmitter, the third device comprises a fifthtransmitter, the fourth device comprises a sixth transmitter, the firstRFI comprises the fourth transmitter coupled to the fourth receiverthrough a third guided transmission medium, the second RFI comprises thefifth transmitter coupled to the fifth receiver through a fourth guidedtransmission medium, and the third RFI comprises the sixth transmittercoupled to the sixth receiver by the fourth guided transmission medium.13. The integrated circuit of claim 12, wherein each of the first guidedtransmission medium, the second guided transmission medium, the thirdguided transmission medium, and the fourth guided transmission mediumcomprises a differential transmission line.
 14. The integrated circuitof claim 11, wherein the first device comprises a processor, the seconddevice comprises a memory device, and at least one of the third deviceor the fourth device comprises a wireless communication device.
 15. Amethod, comprising: generating one or more of a first data signal, asecond data signal or a third data signal to be communicated between afirst device and a second device, the first device and a third device,or the first device and a fourth device, respectively; communicating thefirst data signal between the first device and the second device by wayof a first radio frequency interconnect (RFI) comprising a first channeland configured to carry the first data signal between the first deviceand the second device; and communicating one or more of: the second datasignal between the first device and the third device by way of a secondRFI comprising a second channel and configured to carry the second datasignal between the first device and the third device, or the third datasignal between the first device and the fourth device by way of a thirdRFI comprising the second channel and configured to carry the third datasignal between the first device and the fourth device, wherein thecommunicating the one or more of the second data signal or the thirddata signal comprises: distinguishing between the second and third datasignals based on a frequency of the second data signal and a frequencyof the third data signal, or communicating a control signal tocoordinate the communicating the one or more of the second data signalor the third data signal.
 16. The method of claim 15, wherein thedistinguishing between the second and third data signals based on afrequency of the second data signal and a frequency of the third datasignal comprises: the frequency of the second data signal being based ona first carrier signal of a first set of carrier signals; and thefrequency of the third data signal being based on a second carriersignal of a second set of carrier signals.
 17. The method of claim 16,wherein the communicating the one or more of the second data signal orthe third data signal comprises coordinating transmission of the seconddata signal and the third data signal through the second channel usingfrequency-division duplexing (FDD) based on the first set of carriersignals and the second set of carrier signals.
 18. The method of claim15, wherein the communicating the control signal to coordinate thecommunicating the one or more of the second data signal or the thirddata signal comprises communicating a plurality of control signals tocoordinate transmission of the second data signal and the third datasignal through the second channel based on time-division duplexing(TDD).
 19. The method of claim 18, wherein the communicating theplurality of control signals to coordinate the transmission of thesecond data signal and the third data signal through the second channelcomprises coordinating a direction of the communicating the one or moreof the second data signal or the third data signal through the secondchannel.
 20. The method of claim 18, wherein the communicating theplurality of control signals to coordinate the transmission of thesecond data signal and the third data signal through the second channelcomprises selectively controlling a plurality of switches included inthe second RFI and the third RFI.